Technical depth
Probe command of the specific process modules they claim: lithography, etch, deposition, implant, CMP, and the physics driving each.
Evidence to listen for
- Explains the physics or mechanism behind their work, not just the tooling
- Names the standards, tolerances, and constraints they designed against
- Can defend a design decision under follow-up questions
- Distinguishes what they personally engineered from what the team delivered
Five-point scoring guide
Cannot explain the fundamentals of their own stated specialism.
Knows the vocabulary but not the underlying mechanism; struggles under follow-ups.
Solid working knowledge for the role; depth thins out on edge cases.
Strong command of the domain; explains trade-offs and defends decisions well.
Explains the process physics and the tolerances they designed against, and defends decisions under follow-up.